Studies on Curing Kinetics and Tensile Properties of Silica-Filled Phenolic Amine/Epoxy Resin Nanocomposite
نویسندگان
چکیده
منابع مشابه
Thermal Curing Behavior and Tensile Properties of Resole Phenol-Formaldehyde Resin/Clay/Cellulose Nanocomposite*
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ژورنال
عنوان ژورنال: Polymers
سال: 2019
ISSN: 2073-4360
DOI: 10.3390/polym11040680